- Новости и Аналитика
- CBONDS OLD
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. Our services include: •Packaging services: providing leaded, laminate, memory card and wafer level chip-scale packages (CSP) to customers with a broad range of packaging solutions and full backend turnkey services for a wide variety of electronics applications. We also provide redistribution layers (RDL), integrated passive devices (IPD) and wafer bumping services for flip chip and wafer level CSPs. As part of customer support on packaging services, we also offer package design; electrical, mechanical and thermal simulation; measurement and design of leadframes and laminate substrates. •Test services: including wafer probe and final testing on a diverse selection of test platforms covering the major test platforms in the industry. We have expertise in testing a broad variety of semiconductors, especially mixed-signal, radio frequency (RF), analog and high-performance digital devices. We also offer test-related services such as burn-in process support, reliability testing, thermal and electrical characterization, dry pack and tape and reel. •Pre-production and post-production services: such as package development, test software and related hardware development, warehousing and drop shipment services. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
|10.10.2019||Moody's Investors Service отозвало Долгосрочный Межд. рейтинг в ин. валюте эмитенту STATS ChipPAC|
|09.09.2019||S&P Global Ratings отозвало Долгосрочный Межд. рейтинг в ин. валюте эмитенту STATS ChipPAC|
|09.09.2019||S&P Global Ratings отозвало Долгосрочный Межд. рейтинг в нац. валюте эмитенту STATS ChipPAC|
|12.06.2019||Fitch Ratings отозвало Долгосрочный Межд. рейтинг в ин. вал. эмитенту STATS ChipPAC|
|12.06.2019||Fitch Ratings отозвало Долгосрочный Межд. рейтинг в нац. валюте эмитенту STATS ChipPAC|